2023 2nd International Symposium on Robotics, Artificial Intelligence and Information Engineering

Conference Date

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May 05,2023 May 07,2023

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Submit to Important Indexes

 EI, Scopus

Contact

Phone:
+86-18122478740
E-mail:
wangsiling@ais.cn
WeChat:

Submission (Chinese)

Registration (Chinese)

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About RAIIE 2023

2023 2nd International Symposium on Robotics, Artificial Intelligence and Information Engineering will be held in Qingdao, China, from 5 to 7 May, 2023. This conference mainly focuses on the latest research progress of “Robots”, “Intelligent Bionics” and “Information Science”. The conference brings together international scholars, experts, researchers and relevant practitioners in this field, shares research results, discusses the latest development trend of robots, provides the most cutting-edge academic achievements and scientific and technological information for participants, broadens research horizons and promotes academic progress. 

The Conference sincerely invited experts and scholars from domestic and foreign universities, scientific research institutions, business people and other relevant personnel to participate in the exchange. We look forward to your attendance!

Important Dates

Full Paper Submission DateApril 28, 2023

Registration Deadline: April 28, 2023

Final Paper Submission Date: May 4, 2023

Conference Dates: May 5-7, 2023

Publication

All accepted full papers will be published in conference proceedings and will be submitted to EI Compendex / Scopus  for indexing.


Note: All submitted articles should report original, previously unpublished research results, experimental or theoretical. Articles submitted to the conference should meet these criteria and must not be under consideration for publication elsewhere. We firmly believe that ethical conduct is the most essential virtual of any academic. Hence any act of plagiarism is a totally unacceptable academic misconduct and cannot be tolerated.

Supported By

广东省物联网信息技术重点实验室

Guangdong Key Laboratory of IoT Information Technology(GDUT)


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Venue